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Comparison ledger

HEXP VIISta HEversus160 XP

Applied Materials HEXP VIISta HE, Varian 160 XP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
HEXP VIISta HEApplied Materials
160 XPVarian
OEMApplied MaterialsVarian
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials HEXP VIISta HEVarian 160 XP
Cited variants—
Specifications
ConfigurationIncludes:[2]—
ChillerSMC remote 20M[2]—
Cryo Pump320FE CRYO OBIS,6[3]—
Cryo Pump ExhaustSS Cryo Exhaust Through Roof[3]—
Cryo CompressorIS-1000 KPa X 3[3]—
DosimetryAdvanced[2]—
FacilitiesFaci fr Botm(Air-N2-H2O-Power)[3]—
Frequency60 Hz Operation[3]—
Label KitEnglish[2]—
Load Lock Vent500 Load LockVent Std Finish[3]—
Load Lock Vent Connection500 Vent Con Std Finish[3]—
ManometerTriple Manometer 0-1 kPa[2]—
Power KitStandard Power Kit[2]—
ProfilerStandard Rack and Pinion[2]—
Remote Harness Kit20M Rem Facilites Kit - Floor[2]—
RP3 ExhaustRP3 PVC Exhaust Line - Roof[3]—
Wafer Size8 inch (200mm)[2]—
Platen Type200mm SiC[2]—
Source MaterialSiC[2]—
UPS/CVCFStandard UPS 3KVA - No CVCF[2]—
VCS Software PackageVCS 9.XX (Specify revision)[2]—
Roughing Pump SupplyCustomer Supplied Pumps Onsite[2]—
Turbo Pump SupplyVSE Supplied Pumps[2]—
Wafer Handler Side Window KitWindows[2]—
Configuration (160 XP Ion variant)—150mm High Current IMP[1]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com