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Comparison ledger

Centura eMax Nitrideversus1512e

Applied Materials Centura eMax Nitride, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura eMax NitrideApplied Materials
1512eTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials CenturaTegal 1512e
Specifications
Configuration2 Chamber Emax[1]—
GasCF4, CH2F2, CHF3, Ar, O2, N2[1]—
OSAMAT Legacy[1]—
Buffer RobotHP[1]—
Chiller 1AMAT Endura HX 18706-01[1]—
Chiller 2Thermo Electron HX 150 106178026[1]—
Wafer size8 inch[1]—
Chamber configuration2 Chamber Emax; 1 Orienter/degas[1]—
Gas chemistryCF4, CH2F2, CHF3, Ar, O2, N2[1]—
Operating systemAMAT Legacy[1]—
Chamber #AeMAX[1]—
Chamber #BeMAX[1]—
Chamber #CEMPTY[1]—
Chamber #DEMPTY[1]—
Chamber #EEMPTY[1]—
Chamber #FOrienter[1]—
Tool type—Industrial RIE plasma etcher system[2]
Stated configuration—With modules assembly for CI-4222[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com