Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Finetech Sigma, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | SigmaFinetech |
|---|---|---|
| OEM | Applied Materials | Finetech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Finetech Sigma |
| Specifications | ||
| FPXvision | — | High resolution magnification[1] |
| Placement accuracy | — | Sub-micron (0.5 µm on 300 mm wafer)[1] |
| Substrate size | — | Up to 300 mm[1] |
| Bonding force range | — | 0.2 to 1000 N (up to 1000 N)[2] |
| Working area | — | 450 x 150 mm[3] |
| Vacuum chamber pressure (option) | — | 10^-3 hPa[2] |
| Year of introduction (European premiere at Expoelectronica) | — | 2016[2] |
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