Waferpedia

Comparison ledger

0020 23839 PartversusMark 40 E-Beam

Applied Materials 0020 23839 Part, CHA Mark 40 E-Beam, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
OEMApplied MaterialsCHA
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartCHA Mark 40 E-Beam
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[1]—
Type—E-Beam Evaporator[2]
Process—Physical Vapor Deposition (PVD)[3]
Electron Beam Gun—4-pocket, up to 4 metal materials[3]
Power Supply—CHA SR10 electron beam power supply[3]
Valve Controller—Autotech II[3]
Cryopump—CTI 8[3]
Compressor—CTI[3]
Wafer Size—200 mm (version)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]fabsurplus.comfabsurplus.com