Waferpedia

Comparison ledger

0020 23839 Partversus50 S E-Beam

Applied Materials 0020 23839 Part, CHA 50 S E-Beam, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
OEMApplied MaterialsCHA
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartCHA 50 S E-Beam
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[1]5 pocket[2]
Number of pockets—5[2]
Beam controller—Temescal CV 8 scan / beam controller[2]
Deposition monitor—Maxtech MDC 360[2]
Vacuum pumps—CTI 8" cry pumps with helium recharge units[2]
Type—E-Beam Evaporator Deposition System[2]
Pocket Configuration—5 pocket[2]
Deposition Monitor—Maxtech MDC 360 deposition monitor[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing