Waferpedia

Comparison ledger

0010 47763versusSEZ 203 Spin Processor /

Applied Materials 0010 47763, Lam Research SEZ 203 Spin Processor /, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
OEMApplied MaterialsLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Lam Research SEZ 203 Spin Processor /
Specifications
Configuration2nd Source New[1]—
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]—
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Category—Etch[4]
Wafer size—8 inch[5]
Wafer handling—Bernoulli wafer handling, Bernoulli chuck, Bernoulli grippers[6]
Open cassettes—Two open cassettes[6]
Chemical cabinets—3 chemical cabinets (CDS)[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]waferpedia.comwaferpedia.com
  5. [5]Equipment inventory listing
  6. [6]tech-semi.comtech-semi.com