Waferpedia

Comparison ledger

0010-21246 Partversus1300 X Hot Plate

Applied Materials 0010-21246 Part, CEE 1300 X Hot Plate, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-21246 PartApplied Materials
OEMApplied MaterialsCEE
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—CEE 1300 X Hot Plate
Specifications
Configuration—Vacuum and exhaust[1]
Wafer Sizes—3, 4, 5, 6, 8 inch[1]
Vacuum and Exhaust—Yes[1]
Programmable Bake Process—Up to 250,000 bake processes; unlimited steps per program[1]
Lift Pin—Yes[1]
Operation Modes—Contact, vacuum contact, nitrogen purge, proximity[1]
Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing