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Comparison ledger

0010-18024 Pyrometer AssemblyversusDektak XT

Applied Materials 0010-18024 Pyrometer Assembly, Bruker Dektak XT, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Dektak XTBruker
OEMApplied MaterialsBruker
CategoryMetrology & InspectionMetrology & Inspection
Wafer size—2 in, 4 in, 6 in, 8 in
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-18024 Pyrometer AssemblyBruker Dektak
Specifications
ConfigurationCapable of working on Applied Materials Radiance[1]4" Stage and movement controlled by software[2]
Stylus diameter—12.5 Microns[2]
Measurement type—Stylus surface profiler for thin and thick film step height[3]
Wafer compatibility—2 in, 4 in, 6 in, 8 in[3]
Magnification / Field of View—Selectable 1 to 4 mm FOV[3]
Scan length range—55 mm (with stitching option)[3]
Vertical range—1 mm[3]
Step-height repeatability—5 Å[3]
Low force (N-Lite+)—0.03 to 15 mg[3]
3D capabilities—3D stress and 3D mapping[3]
Compatible wafer sizes—2", 4", 6", 8"[3]
Selectable magnification—1 to 4mm FOV[3]
N-Lite+ Low Force—0.03 to 15mg[3]
3D stress and 3D mapping—Supported[3]
Tool Type—Stylus surface profiler[3]
Wafer Compatibility—2″, 4″, 6″, 8″ wafers[3]
Field of View Magnification—Selectable, 1 to 4mm FOV[3]
Type—stylus surface profiler[3]
Measurement purpose—advanced thin and thick film step height measurement[3]
Low force mode—N-Lite+ Low Force with 0.03 to 15mg[3]
Measurement modes—3D stress and 3D mapping[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]epfl.chepfl.ch