Comparison ledger
Applied Materials 0010-16392 ESC Assembly, Tegal 901, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-16392 ESC AssemblyApplied Materials | 901Tegal |
|---|---|---|
| OEM | Applied Materials | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-16392 ESC Assembly | Tegal 901 |
| Specifications | ||
| OEM | Applied Materials[1] | — |
| Model | 0010-16392[1] | — |
| Type | ESC Assembly[1] | — |
| Wafer Size | 300 mm[2] | — |
| Electrode Configuration | Dual[2] | — |
| Configuration | — | Poly[3] |
| Wafer size | — | 3 inch, 100 mm to 150 mm[5] |
| Primary process | — | non-critical silicon nitride and photoresist trim[5] |
| Reactor type | — | wide gap RF diode reactor[5] |
| Temperature regime | — | low temperature plasma etch[5] |
| Wafer handling | — | no wafer clamps or electrostatic chucks[5] |
| Additional process | — | poly etching[3] |
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