Waferpedia

Comparison ledger

0010-16392 ESC AssemblyversusAlcatel 601 E DRIE

Applied Materials 0010-16392 ESC Assembly, Pfeiffer Alcatel 601 E DRIE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
OEMApplied MaterialsPfeiffer
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyPfeiffer Alcatel
Specifications
OEMApplied Materials[1]—
Model0010-16392[1]601 E[3]
TypeESC Assembly[1]Deep Reactive Ion Etch system[4]
Wafer Size300 mm[2]—
Electrode ConfigurationDual[2]—
Configuration—With:[3]
Category—Etch[4]
Make—Pfeiffer / Alcatel[3]
Power—Advanced Energy RF-F2[4]
Vacuum—VAT Adaptive Pressure Controller[4]
Configuration / options—Alcatel ACT 1300 M[3]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com