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Comparison ledger

UF 3000 EX Automatic Waferversus11000

Accretech UF 3000 EX Automatic Wafer, Cascade Microtech 11000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
11000Cascade Microtech
OEMAccretechCascade Microtech
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech UF 3000Cascade Microtech 11000
Specifications
OS VerS6.39.BH[1]—
InputAC 210V Single pulse[1]—
Configuration12" Nickel Hot Chucktop[1]With antivibration table[4]
Head Plate Center Hole Size528mm[1]—
TypeAutomatic wafer prober[2]—
Hot temp controllerRoom~150C[1]—
OS versionS6.39.BH[1]—
Chucktop12" Nickel Hot Chucktop[1]—
Z stageStandard Z Force Stage[1]—
LoaderOpen Foub Single Loader[1]—
OCRType 6 OCR (Rear-Face Only)[1]—
Probe card trayAuto Probe Card Tray (O)[1]—
Cleaning unit blockCleaning Unit Block (O), Cleaning Ceramic Plate(X)[1]—
PortsUSB Port; Ethernet Port[1]—
Card holder clamp motor optionNo[1]—
Auto tilt optionNo[1]—
Configured wafer sizes8" or 12" wafers[3]—
Chuck typeNickel[3]—
FOUP portSingle FOUP port for 25 wafers[3]—
TransportDual robotic wafer transport arms[3]—
AlignmentAuto needle alignment; advanced wafer alignment unit; alignment camera E1-500[3]—
StageQuad-Pod Z stage[3]—
Interface optionsGPIB interface option; Ethernet interface option[3]—

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]jadgrp.comjadgrp.com
  4. [4]inventory listing
  5. [5]inventory listing