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Comparison ledger

HRG 200versusHRG 200 X

Accretech HRG 200, Accretech HRG 200 X, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
HRG 200Accretech
HRG 200 XAccretech
OEMAccretechAccretech
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech HRG 200Accretech HRG 200
Specifications
ConfigurationHigh Rigid[1]—
Grinding Wheel Diameter—250 mm[2]
Grinding Wheel Spindle Speed—Max. 3600 rmp[2]
Working Spindle Speed—800 rpm[2]
Motor Power—6.3 KW[2]
Wafer Sizes—2, 3, 4, 5, 6, 8 inch[2]
Wafer Size Range—2-inch to 8-inch wafers[3]
Machine Type—Fully Automatic High Rigid 2-Axis Grinder[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]accretech.comaccretech.com