Waferpedia

Comparison ledger

-407B-2-S-CE-S293 RobotversusVCD

ABM -407B-2-S-CE-S293 Robot, Universal Instruments VCD, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
VCDUniversal Instruments
OEMABMUniversal Instruments
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyABM -407B-2-S-CE-S293 RobotUniversal Instruments VCD
Cited variants—
Specifications
ModelABM-407B-2-S-CE-S293[4]—
DescriptionROBOT[4]—
Refurbished RTP RTAAG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[4]—
KLA-Tencor Spare Parts and ServiceRS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[4]—
Refurbished Isotropic Plasma EtcherMatrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[4]—
Refurbished PECVD, ALD EquipmentCambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[4]—
Refurbished Mask AlignerCanon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[4]—
Refurbished BondingSUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[4]—
Refurbished Wafer ProberElectroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[4]—
Throughput—24,500 cph[1]
Reliability—200 ppm[1]
Component inputs—Expandable from 20 to 100 in increments of 20[1]
Insertion pitch—High-density: 5.00–22.02 mm; High-reliability: 7.62–22.48 mm (optional kit up to 24.00 mm)[1]
Topside PCB clearance—20.0 mm[1]
Clinch angle—45° to 90°[1]
Electrical requirements—Single-phase AC 180–246 V, 1150 VA, 47–63 Hz with UPS backup[1]
PCB dimensions, automated—102 mm x 80 mm to 483 mm x 406 mm[1]
PCB dimensions, manual—51 mm x 51 mm to 600 mm x 600 mm[1]
Sources (4)Every fact above is drawn from these public sources
  1. [1]uic.comuic.com
  2. [2]nt2004.comnt2004.com
  3. [3]manualslib.commanualslib.com
  4. [4]dealer listingsemistarcorp.com