Comparison ledger
ABM -407B-1-S-CES293 Robot, SUSS MicroTec AS 8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AS 8SUSS MicroTec | |
|---|---|---|
| OEM | ABM | SUSS MicroTec |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | SUSS MicroTec AS 8 |
| Specifications | ||
| Model | ABM-407B-1-S-CES293[1] | — |
| Description | ROBOT[1] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1] | — |
| Substrate size (round) | — | up to 200 mm[2] |
| Substrate size (square) | — | up to 6" edge length[2] |
| Dual-nozzle substrate sizes | — | Ø150 mm, Ø200 mm[2] |
| Single-nozzle substrate sizes | — | Ø3", Ø100 mm, Ø150 mm, Ø200 mm[2] |
| Z-axis adjustment range | — | up to 45 mm[2] |
| Nozzle adjustment range | — | 67.5 mm to 107.5 mm[2] |
| Spray axis maximum velocity | — | 500 mm/s[2] |
| Spray axis acceleration | — | up to 9 m/s²[2] |
| Chuck maximum rotation speed | — | 1,000 rpm[2] |
| Heated chuck | — | optional[2] |
| Splash-ring design | — | included[2] |