Comparison ledger
ABM -407B-1-S-CES293 Robot, SUSS MicroTec Alignment, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AlignmentSUSS MicroTec | |
|---|---|---|
| OEM | ABM | SUSS MicroTec |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | SUSS MicroTec Alignment |
| Cited variants | — | |
| Specifications | ||
| Model | ABM-407B-1-S-CES293[2] | Alignment[4] |
| Description | ROBOT[2] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2] | — |
| Manufacturer | — | SUSS MicroTec[3] |
| Asset name | — | SUSS Alignment Tool[4] |
| Product family | — | Mask Alignment[1] |
| Substrate size | — | Up to 300 mm[1] |
| Alignment mode | — | Mask-to-wafer and wafer-to-wafer alignment[1] |
| Integrated metrology | — | Wafer prealignment and notch detection[1] |
| Topside alignment | — | Supported[5] |
| Backside alignment | — | Supported[5] |
| Substrate diameter range | — | 1" to 150 mm diameter[5] |
| Mask size range | — | 2.5" x 2.5" to 7" x 7"[5] |
| Maximum substrate thickness | — | 10 mm[5] |
| Resist compatibility | — | For use with i-line resists[5] |
| Tool type | — | Mask alignment[1] |
| Supported substrate size | — | up to 300 mm[1] |
| Alignment modes | — | mask-to-wafer and wafer-to-wafer alignment[1] |
| Alignment optics | — | precision optics[1] |
| Related system | — | MA/BA6 Mask Alignment System[5] |