Waferpedia

Comparison ledger

1000PversusCV200 RFS

YES 1000P, YES CV200 RFS, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMYESYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size—50mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones1998 Acquisition—
Control system——
Generation——
FamilyYES 1000PYES CV200 RFS
Specifications
Model1000P[1]—
System typePlasma cleaning system[1]—
Shelf configurationFour 16 x 16 inch shelves[1]—
Total capacity1024 square inches[1]—
Control systemPLC driven with plain English real time process readout and diagnostics in the event of system abort[1]—
Number of shelves4[1]—
Shelf size16 x 16 inches[1]—
Power1000 W[2]—
ConfigurationParallel plate[2]—
Operation modesActive, RIE, Downstream[1]—
Sample size rangeFrom smallest semiconductor chip to large flat panels[1]—
Process—Plasma strip / descum system[3]
Wafer size—50 mm to 200 mm[3]
Power supply—Variable Power Supply from 150 W to 1250 W[3]
Resist removal rate—Up to 7000 angstroms per minute[3]
Temperature measurement—Real-time wafer temperature measurement[3]
Temperature control—Flexible temperature control[3]
Gas inputs—Multiple process gas inputs[3]
Design—Unique downstream protective design[3]
Wafer size range—50 mm to 200 mm[3]
Power supply range—150 W to 1250 W[3]

Plan your fab

Building a Wet Processing / Clean process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]pnf.uchicago.edupnf.uchicago.edu