Waferpedia

Comparison ledger

10490versus747677E

West Bond 10490, West Bond 747677E, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
747677EWest Bond
OEMWest BondWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyWest Bond 10490West Bond 747677E
Specifications
ManufacturerWest Bond[1]—
Model10490[1]747677E[4]
DescriptionConvertible bonder, wedge to ball[2]—
Tool typeConvertible bonder[3]—
Bonding modesWedge bonding and ball bonding[3]—
UseWire bonding[3]—
OEM—West Bond[4]
Location—Sample Prep Room[4]
Primary training contact—Talmage Tyler[4]
Bond force range—10-250 grams[4]
Ultrasonics—built-in, 4 watts[4]
Wire size—1 mil (25.4 um)[4]
Ball bond size—~ 85 um[4]
Equipment type—Wire bonder[5]
Primary bonding material—Gold wire[4]
Bonding configuration—Ball bonding[4]
Convertible bonding methods—Wedge and ball bonding[6]
Compatible wire materials—Al and Au wires[6]
Compatible wire diameter range—0.7 mil to 2 mil[6]
Ultrasonic transducer—4 W, 63 kHz[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]smif.pratt.duke.edusmif.pratt.duke.edu
  5. [5]smif.pratt.duke.edusmif.pratt.duke.edu
  6. [6]uwaterloo.cauwaterloo.ca