Waferpedia

Comparison ledger

10100versus7700E

West Bond 10100, West Bond 7700E, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10100West Bond
7700EWest Bond
OEMWest BondWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyWest Bond 10100West Bond 7700E
Cited variants—
Specifications
Wire diameter range—0.0007 inches (minimum, upper limit not stated)[1]
Tool shank diameter—1/16 inch[1]
Tool length—0.625 inch (standard) or 0.750 inch (deeper access)[1]
Spool mount size—1/2 inch ball bearing spool mount[1]
Ultrasonic generator power—4 Watts, dual channel[1]
Number of wire buffers—30[1]
Bonds per wire (maximum)—21[1]
Workholder substrate size (example)—2x2 inches (with mechanical clamp and inert atmosphere cavity)[1]
Bonding method—Thermosonic ball-wedge[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]manualslib.commanualslib.com