Waferpedia

Comparison ledger

1512eversusTE 8500 PESC Dry

Tegal 1512e, Tokyo Electron TE 8500 PESC Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1512eTegal
TE 8500 PESC DryTokyo Electron
OEMTegalTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTegal 1512eTokyo Electron TE 8500
Specifications
Tool typeIndustrial RIE plasma etcher system[1]—
Stated configurationWith modules assembly for CI-4222[1]—
Configuration—1 chamber[2]
Gas—CF4, CHF3, He[2]
Process type—Dry etcher[3]
Number of chambers—1 chamber[2]
Process application—Oxide etch with end point[2]
Process gases—CF4, CHF3, He[2]
Operating system (OS)—EPROM based system[2]
Loaders (LD)—2ea, Fortrend[2]
Pumps—2ea, Ebara, A30W[2]
Listed unit vintage—1996[2]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]semistarcorp.comsemistarcorp.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com