Waferpedia

Comparison ledger

1512eversusTE 8500

Tegal 1512e, Tokyo Electron TE 8500, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1512eTegal
TE 8500Tokyo Electron
OEMTegalTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTegal 1512eTokyo Electron TE 8500
Cited variants—
  • TE 8500 P Dry[1]
  • TE 8500 PESC Dry[1]
Specifications
Tool typeIndustrial RIE plasma etcher system[2]—
Stated configurationWith modules assembly for CI-4222[2]—
Wafer size—6 inch[1]
Process type—Etch (Dry)[4]
Chambers (PESC Dry)—1[1]
Application (PESC Dry)—Oxide etch with endpoint capability[1]
Vintage—1994[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]Equipment inventory listing
  4. [4]layla-ec.comlayla-ec.com