Comparison ledger
SUSS MicroTec XBC300 Gen2 D2W/W2W, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | XBC300 Gen2 D2W/W2WSUSS MicroTec | 10490West Bond |
|---|---|---|
| OEM | SUSS MicroTec | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | Gen2 | — |
| Family | SUSS MicroTec XBC300 Gen2 D2W/W2W | West Bond 10490 |
| Cited variants |
| — |
| Specifications | ||
| Bonding Types | die-to-wafer (D2W), wafer-to-wafer (W2W)[1] | — |
| Platform | scalable, modular[1] | — |
| Bonding Processes Supported | temporary, permanent, hybrid bonding[1] | — |
| Manufacturer | — | West Bond[2] |
| Model | — | 10490[2] |
| Description | — | Convertible bonder, wedge to ball[3] |
| Tool type | — | Convertible bonder[4] |
| Bonding modes | — | Wedge bonding and ball bonding[4] |
| Use | — | Wire bonding[4] |
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