Comparison ledger
SUSS MicroTec FC 250, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | FC 250SUSS MicroTec | 10490West Bond |
|---|---|---|
| OEM | SUSS MicroTec | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec FC 250 | West Bond 10490 |
| Specifications | ||
| Configuration | With a Julabo FLW1703 Chiller[1] | — |
| Maximum chip/substrate temperature | 450°C[2] | — |
| Bonding force range | 10 gf to 200 kgf[2] | — |
| Alignment accuracy (X/Y) | 1 µm at 3σ[2] | — |
| Optical magnification | 400X[2] | — |
| Objective numerical aperture | 0.3[2] | — |
| Heating rate | 30 °C/s to 100 °C/s[2] | — |
| Stage resolution | 0.1 µm[2] | — |
| Minimum device size | 250 µm × 300 µm[2] | — |
| Granite plate flatness | 2 µm[2] | — |
| Stage size | 2 × 2 inches[1] | — |
| Manufacturer | — | West Bond[3] |
| Model | — | 10490[3] |
| Description | — | Convertible bonder, wedge to ball[4] |
| Tool type | — | Convertible bonder[5] |
| Bonding modes | — | Wedge bonding and ball bonding[5] |
| Use | — | Wire bonding[5] |
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