Waferpedia

Comparison ledger

1070versusUltra Flex BB 512

Signatone 1070, Teradyne Ultra Flex BB 512, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1070Signatone
OEMSignatoneTeradyne
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySignatone 1070Teradyne Ultra Flex
Specifications
MakeSignatone[1]—
Model1070[1]—
Slot 0—GigaDig HD 2[2]
Slot 4—HSS 6400[2]
Slot 6—HSD-M[2]
Slot 7—HSD-M[2]
Slot 8—HSD-M[2]
Slot 9—HSD-M[2]
Slot 11—Turbo-Frame[2]
Slot 14—HSD-M[2]
Slot 15—HSD-M[2]
Slot 16—HSD-M[2]
Slot 17—HSD-M[2]
Slot 18—DC-30[2]
Slot 19—HexVS[2]
Slot 20—DC-30[2]
Slot 21—HexVS[2]
Slot configuration—Slot 0: GigaDig HD 2; Slot 4: HSS 6400; Slot 6: HSD-M; Slot 7: HSD-M; Slot 8: HSD-M; Slot 9: HSD-M; Slot 11: Turbo-Frame; Slot 14: HSD-M; Slot 15: HSD-M; Slot 16: HSD-M; Slot 17: HSD-M; Slot 18: DC-30; Slot 19: HexVS; Slot 20: DC-30; Slot 21: HexVS[2]

Plan your fab

Building a Test & Probe process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing