Comparison ledger
PR Hoffman 108T, Strasbaugh 6 DS SP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 108TPR Hoffman | 6 DS SPStrasbaugh |
|---|---|---|
| OEM | PR Hoffman | Strasbaugh |
| Category | CMP | CMP |
| Wafer size | up to 12 in wafers | Single Wafer SiC Substrate |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | PR Hoffman 108T | Strasbaugh 6 DS SP |
| Specifications | ||
| carrier type listing | 108T 9B - S/F / Lapmaster LSP-9 / etc.[1] | — |
| machine class | for double-sided planetary lapping & polishing machines[1] | — |
| wafer sizes stated on insert-carrier page | 3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[1] | — |
| maximum carrier diameter stated on insert-carrier page | up to 33 in diameter[1] | — |
| maximum carrier diameter stated on lapping-carrier page | up to 48 in diameter[2] | — |
| Configuration | — | Multi Process[3] |
| Voltage | — | 208 V, 3 Phase, 60 Hz[4] |
| Full Load | — | 60 A[4] |
| Motor | — | 36 A[4] |
| Interrupting Capacity | — | 10,000 A[4] |
| Wafer size | — | Single Wafer SiC Substrate[4] |