Waferpedia

Comparison ledger

108Tversus100R16

PR Hoffman 108T, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
108TPR Hoffman
100R16Strasbaugh
OEMPR HoffmanStrasbaugh
CategoryCMPCMP
Wafer sizeup to 12 in wafers—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyPR Hoffman 108TStrasbaugh 100R16
Specifications
carrier type listing108T 9B - S/F / Lapmaster LSP-9 / etc.[1]—
machine classfor double-sided planetary lapping & polishing machines[1]—
wafer sizes stated on insert-carrier page3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[1]—
maximum carrier diameter stated on insert-carrier pageup to 33 in diameter[1]—
maximum carrier diameter stated on lapping-carrier pageup to 48 in diameter[2]—
type—1 spindle grinder/polisher[3]
drive system—DC drive system with 2 motors[3]
spindle RPM—1-180 RPM[3]
eccentric RPM—1-90 RPM[3]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[3]
capacity—16 inches[3]
spindle size—1-8 TPI[3]
overall dimensions—28 inches x 36 inches x 48 inches[3]
weight—500 lbs[3]
origin—made in the USA[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org
  3. [3]excelltechnology.comexcelltechnology.com