Waferpedia

Comparison ledger

plasmapro-ngp80-rieversus980

Oxford Instruments plasmapro-ngp80-rie, Tegal 980, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
plasmapro-ngp80-rieOxford Instruments
980Tegal
OEMOxford InstrumentsTegal
CategoryEtchEtch
Wafer size200mm200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOxford Instruments plasmapro-ngp80-rieTegal 980
Cited variants—
Specifications
Equipment nameOxford NGP80 RIE[2]—
Tag/aliasOxford-PlasmaPro-NGP80-RIE[2]—
Process typeplasma etch[2]Plasma etch[1]
Etch chemistryCHF3/Ar plasma[3]—
Process temperature20°C[3]—
Typical applicationEtching of SiO2 hard mask[3]—
plasma chemistryCHF3/Ar plasma[3]—
useEtching SiO2 hard mask[3]—
Series name—980 ACS Series[1]
Wafer size—200mm[1]
System type—Single wafer cassette-to-cassette etch system[1]
Throughput—Faster throughput[1]
Calibration—Faster system calibration[1]
User interface—Touchscreen graphical user interface[1]
Data handling—Integrated data logging[1]
Factory automation—Factory automation support[1]
Tool format—Single wafer cassette-to-cassette etch system[1]
System calibration—Faster system calibration[1]
Automation—Factory automation support[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
  3. [3]discovery.ucl.ac.ukdiscovery.ucl.ac.uk
  4. [4]eprints.gla.ac.ukeprints.gla.ac.uk