Comparison ledger
Oxford Instruments 100 ICP Fluorine, Ulvac NE 950 EX ICP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | NE 950 EX ICPUlvac |
|---|---|---|
| OEM | Oxford Instruments | Ulvac |
| Category | Etch | Etch |
| Wafer size | — | Wafer end effector |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Ulvac NE 950 |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | Wafer end effector[2] |
| Configuration | — | Toshiba FA2-100SS computer[2] |
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