Comparison ledger
Oxford Instruments 100 ICP Fluorine, Oxford Instruments Plasmalab 100 ICP-RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | Plasmalab 100 ICP-RIEOxford Instruments |
|---|---|---|
| OEM | Oxford Instruments | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Oxford Instruments Plasmalab 100 |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | — |
| Process gases used | — | H2, O2, N2, Ar, CF4, SF6, CHF3, He, CH4, HBr, Cl2 and BCl3[2] |
| Cryo Table w/ operating temp | — | -150 to 400C[2] |
| Substrate cooling | — | using liquid nitrogen (LN2)[2] |
| Configuration | — | RF source 300 W, 13.56 MHz[2] |
| Base pressure | — | 5E-7 Torr[2] |
| Main Chamber Backing Pump | — | Adixen ADP 122P Dry pump[2] |
| Main Chamber Turbo Pump | — | Adixen ATH 1300 Turbo[2] |
| Load Lock | — | Adixen ACP 15G Dry pump[2] |
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