Comparison ledger
Nitto HR 8500 III TW UV Detaper, YES 1000P, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1000PYES | |
|---|---|---|
| OEM | Nitto | YES |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 1998 Acquisition |
| Control system | — | — |
| Generation | — | — |
| Family | Nitto HR 8500 III TW UV Detaper | YES 1000P |
| Specifications | ||
| Control Method | One Board Micro Computer[1] | — |
| Wafer Transfer Robot | 3-axis type[1] | — |
| Configuration | Installation Environment:[1] | Parallel plate[3] |
| Temperature | 25 ± 5 degrees C[1] | — |
| Humidity | 45 ± 15%[1] | — |
| Others | Clean level ; Class 1,000 or more (Place where it will be subjected to direct sunlight)[1] | — |
| Power | 1.5 kVA[1] | 1000 W[3] |
| For Air | Rc 3/8 screw[1] | — |
| Lug with grounding linw (Cable Length | Approx. 5m)[1] | — |
| OEM | Nitto Denko[1] | — |
| Model | HR 8500 III TW UV[1] | 1000P[2] |
| Wafer Sizes | 8 inch[1] | — |
| Clean level | Class 1,000 or more[1] | — |
| Power Supply | Single Phase; AC 100 V ± 5%; 1.5 kVA; 50/60 Hz[1] | — |
| Air Supply | Dry Air; 0.5 MPa or more; 250 NL/min or more[1] | — |
| Connection Port | For electrical power; For Air: Rc 3/8 screw; Lug with grounding linw (Cable Length: Approx. 5m)[1] | — |
| System type | — | Plasma cleaning system[2] |
| Shelf configuration | — | Four 16 x 16 inch shelves[2] |
| Total capacity | — | 1024 square inches[2] |
| Control system | — | PLC driven with plain English real time process readout and diagnostics in the event of system abort[2] |
| Number of shelves | — | 4[2] |
| Shelf size | — | 16 x 16 inches[2] |
| Operation modes | — | Active, RIE, Downstream[2] |
| Sample size range | — | From smallest semiconductor chip to large flat panels[2] |
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