Comparison ledger
MRSI 705HF, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 705HFMRSI | 10100West Bond |
|---|---|---|
| OEM | MRSI | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | Windows | — |
| Generation | — | — |
| Family | MRSI 705HF | West Bond 10100 |
| Specifications | ||
| Machine type | 5-micron high force die bonder[1] | — |
| Bond head | Heated bond head[1] | — |
| Maximum force | Up to 500N[1] | — |
| Top heating temperature | Up to 400°C[1] | — |
| Placement accuracy | +/- 5 microns or better[1] | — |
| Work area | 700 sq.in[1] | — |
| Maximum waffle packs | Up to 90 when using the Sector Plate Shuttle[1] | — |
| Force at component | As low as 10 grams[1] | — |
| Motion axes | Up to 32 axes of motion[1] | — |
| Linear encoder resolution | 0.1-micron resolution[1] | — |
| Tool bank | Thirteen-position tool bank with fast automatic tool change[1] | — |
| Control platform | Windows GUI[1] | — |
| Integration | SMEMA compatibility[1] | — |
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