Waferpedia

Comparison ledger

WS-750-23 Bversus211

Laurell WS-750-23 B, TEGAL 211, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
211TEGAL
OEMLaurellTEGAL
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLaurell WS-750-23 BTEGAL 211
Specifications
Model TypeSpin Coater[1]—
Series750-series[1]—
Max. Substrate Sizeø 150mm (5" × 5")[1]—
Max. RPM12000 rpm[1]—
Mounting OptionsTabletop, In-Deck, On-deck[1]—
TypeSpin Coater[1]—
Maximum Substrate SizeØ150mm (5" x 5")[1]—
Maximum Speed12000 rpm[1]—
Refurbished RTP RTA—AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2]
KLA-Tencor Spare Parts and Service—RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2]
Refurbished Isotropic Plasma Etcher—Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2]
Refurbished PECVD, ALD Equipment—Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2]
Refurbished Mask Aligner—Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2]
Refurbished Bonding—SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2]
Refurbished Wafer Prober—Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2]
Process Type—Plasma Asher/Etcher[3]
Wafer Size (max)—3 inch[3]
Form Factor—Table top[3]
Chamber Material—Aluminum[2]
Chamber Internal Dimensions—6 x 6 x 3.75 inches[2]
Timer Range—0-99 minutes[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]images.laurell.comimages.laurell.com
  2. [2]dealer listingsemistarcorp.com
  3. [3]jmind.comjmind.com