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Comparison ledger

EDC-HL-15 BversusWS-650-15 B

Laurell EDC-HL-15 B, Laurell WS-650-15 B, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMLaurellLaurell
CategoryResist ProcessingResist Processing
Wafer size300mm300mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLaurell EDC-HL-15 BLaurell WS-650-15 B
Specifications
OEMLaurell[1]Laurell[2]
ModelEDC-HL-15 B[1]WS-650-15 B[2]
TypeEDC™ System[1]Spin Coater[1]
Controller650-series[1]650-series[1]
Max. substrate size300mm (9" x 9")[1]—
Max. RPM12000 rpm[1]—
Mounting optionsTabletop, In-Deck, On-deck[1]—
Max Substrate Size—ø 300mm (9" × 9")[1]
Max RPM—12000 rpm[1]
Mounting Options—Tabletop, In-Deck, On-Deck[1]
Series—650-series[2]
Max substrate size—ø 300mm wafers and 9" × 9" (229mm × 229mm) substrates[2]
Category—Spin Coater[1]
Processes supported—Coating, Etching, Developing, Rinsing-Drying and Cleaning[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]images.laurell.comimages.laurell.com
  2. [2]laurell.comlaurell.com