Waferpedia

Comparison ledger

120 Continuousversus6 EC CMP Wafer

Lapmaster 120 Continuous, Strasbaugh 6 EC CMP Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
6 EC CMP WaferStrasbaugh
OEMLapmasterStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 120 ContinuousStrasbaugh 6 EC CMP Wafer
Specifications
Make—Strasbaugh[1]
Model—6 EC CMP[1]
System type—CMP Wafer Polisher[1]
System description—Economical tool for CMP research, failure analysis, and low-volume production[2]
Operation—Semi-automatic[2]
GUI—Color, touch-screen GUI[2]
Table and spindle motors—Closed-loop table and spindle RPM motors[2]
Pad conditioning—Programmable pad conditioning[2]
Programmable control zones—20 zones[2]
Programmable control parameters—Dwell time, down force, and RPM[2]
Pad conditioning media—Diamond plated disk or nylon brush[2]
Option—ViPRR carriers[2]
Asset #—73620[1]
Operating mode—semi-automatic[2]
User interface—color, touch-screen GUI[2]
Process control zones—20 zones of programmable control[2]
Facility utility requirements—DI Water: 30 psi minimum, 1.5 GPM flow rate; Vacuum: 25" HG; Air: 100 psi, 5 SCFM; Electrical: 208 or 230 VAC, 3 phase, 60 Hz, 20 AMPS with conditioner, 30 AMPS; Exhaust: approx. 100 CFM[2]
Pad conditioning tools—diamond plated disk or nylon brush[2]
Options—ViPRR carriers[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]s3-alliance.coms3-alliance.com