Waferpedia

Comparison ledger

12 Lapperversus36

Lapmaster 12 Lapper, Lapmaster 36, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
36Lapmaster
OEMLapmasterLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Lapmaster 36
Cited variants—
  • Pneumatic Lift Version[1]
  • Open Face Version[1]
Specifications
Outside plate diameter12 inches[2]—
Lapping Speed Range0 to 60 rpm[3]—
Wafer Size Compatibility4 inches or smaller[2]—
Input Voltage110 V[2]—
Frequency60 Hz[2]—
Phase1[2]3 Phase[4]
Number of Rings3[2]—
Number of Weights3[2]—
Includes Slurry SystemYes[2]—
Includes TimerYes[2]—
Configuration—Two Rings Pump[5]
Model Type—36[1]
Number of Conditioning Rings—3[1]
Drive Motor—4 kW (5 HP)[1]
Standard Lap Plate Speed—58 rpm[1]
Lapping Plate Outer Diameter—36 inches (914 mm)[1]
Lapping Plate Inner Diameter—6.75 inches (172 mm)[1]
Conditioning Ring Outer Diameter—419 mm (16.5 inches)[1]
Conditioning Ring Inner Diameter—368 mm (14.5 inches)[1]
Wear Life—2.8 inches (70 mm)[1]
Weight—1202 kg (2650 lbs)[1]
Shipping Weight—1383 kg (3050 lbs)[1]
Power Supply—230 V/460 V, 3 phase, 60 Hz[1]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]jmind.comjmind.com
  3. [3]etd.ohiolink.eduetd.ohiolink.edu
  4. [4]inventory listing
  5. [5]inventory listing