Waferpedia

Comparison ledger

Kiyo 45versus100 ICP Fluorine

Lam Research Kiyo 45, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Kiyo 45Lam Research
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research KiyoOxford Instruments 100 ICP Fluorine
Specifications
Configuration2 Chamber + 1 Strip[1]—
LoadportBrooks 799-701175-005[1]—
ATM RobotBrooks P/N 138150[1]—
TM RobotBrooks P/N 201600-01[1]—
MKS E28B-30200 Process Vacuum Gauge0.1 Torr[1]—
MKS 625A-14059 Chamber Vacuum Gauge1 Torr[1]—
MKS D24B12TCECB0 Micro Wave Vacuum Gauge100 Tor[1]—
Chamber configuration2 Chamber + 1 Strip[1]—
Process Vacuum GaugeMKS E28B-30200, 0.1 Torr[1]—
Chamber Vacuum GaugeMKS 625A-14059, 1 Torr[1]—
Micro Wave Vacuum GaugeMKS D24B12TCECB0, 100 Torr[1]—
Air Lock Heating GaugeTeledyne HPM-2002-OBE-LM[1]—
Turbo PumpEdwards SCU 1500[1]—
Turbo Pump ControllerEdwards SCU 1600[1]—
Bias RF GeneratorLam 3156110-214[1]—
TCP RF GeneratorLam 3156110-313[1]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[2]
Cryo DRIE etch rate—up to 5 µm/min[2]
Wafer size—4 inch, 6 inch, 8 inch (with clamp change)[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]nanofab.utah.edunanofab.utah.edu