Waferpedia

Comparison ledger

Alliance 9100 PTX Dryversus100 ICP Fluorine

Lam Research Alliance 9100 PTX Dry, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research AllianceOxford Instruments 100 ICP Fluorine
Specifications
2chVia/CW PM1/2[1]—
ConfigurationOxide H[1]—
Wafer size8 inch[1]4 inch, 6 inch, 8 inch (with clamp change)[2]
Chamber count2[1]—
Process modulesVia/CW PM1/2, Oxide H 2000[1]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[2]
Cryo DRIE etch rate—up to 5 µm/min[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]nanofab.utah.edunanofab.utah.edu