Comparison ledger
Lam Research 2300 e 5 Kiyo, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2300 e 5 KiyoLam Research | 100 ICP FluorineOxford Instruments |
|---|---|---|
| OEM | Lam Research | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research 2300 | Oxford Instruments 100 ICP Fluorine |
| Specifications | ||
| Configuration | 3 Chamber + 1 Strip[1] | — |
| Loadport | TDK TAS300[1] | — |
| ATM Robot | Kawasaki P/N 3NT510B-A002[1] | — |
| TM Robot | Brooks 201600-294-0002[1] | — |
| MKS E28D-29237 Process Vacuum Gauge | 0.1 Torr[1] | — |
| MKS 625D-30518 Chamber Vacuum Gauge | 1 Torr[1] | — |
| Number of Chambers | 3 Chamber + 1 Strip[1] | — |
| Turbo Pump | Edwards STP-XA3203CV[1] | — |
| Turbo Pump Controller | Edwards SCU-1600[1] | — |
| Bias RF Generator | Lam 3156110-214[1] | — |
| Etch Gases | — | SF6, CF4, O2, Ar, N2, CHF3, C4F8[2] |
| Cryo DRIE etch rate | — | up to 5 µm/min[2] |
| Wafer size | — | 4 inch, 6 inch, 8 inch (with clamp change)[2] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →