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Comparison ledger

2300 e 5 Exelan Flex EXversus100 ICP Fluorine

Lam Research 2300 e 5 Exelan Flex EX, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research 2300Oxford Instruments 100 ICP Fluorine
Specifications
ConfigurationMF only[1]—
OEMLam Research[2]—
Model2300 e 5 Exelan Flex EX[2]—
CategoryEtch[1]—
Wafer size12 inch[2]4 inch, 6 inch, 8 inch (with clamp change)[3]
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[3]
Cryo DRIE etch rate—up to 5 µm/min[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]nanofab.utah.edunanofab.utah.edu