Kulicke & Soffa
IBond 5000 alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
Branson
318-008-021 Horn
Packaging & Bonding
Branson 318-008-021 Horn is a circular high grain horn with a 3-inch diameter, 0.9 horn gain, and a black max booster.
ASM
AB 559 A 06 Wedge
Packaging & Bonding
The ASM AB 559 A 06 is a wedge bonder offered by ASM.
Besi
DS 9000 E
Packaging & Bonding
The Besi / Datacon DS 9000 E is a bonder with an 8-inch wafer size and 208 VAC single-phase, 50/60 Hz power specifications.
Shinkawa
UTC 5000
Packaging & Bonding
The Shinkawa UTC 5000 is a wire bonder that handles 12-inch wafers.
ASM
AD 838 L
Wafer Loader
Packaging & Bonding
The ASM AD 838 L is a die bonder for semiconductor packaging applications.
Applied Materials
0010-47763 ASSY ESC Bonded Monopolar Dual Heated
Packaging & Bonding
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
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