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Comparison ledger

0035235-003 MMD HeadversusCandela 8720 Surface Defect

KLA 0035235-003 MMD Head, KLA Candela 8720 Surface Defect, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA 0035235-003 MMD HeadKLA Candela
Specifications
ConfigurationTSTD PCB ASSY, MMD MEAS HEAD[1]Optical System Unit[2]
Model0035235-003[1]—
MakeKLA[1]—
Part DescriptionTSTD PCB ASSY, MMD MEAS HEAD[1]—
Compatible SystemKLA AIT-XP[1]—
Single Wafer Loading—Automatic Transfer by Wafer Transfer Robot[2]
Wafer Thickness Detection—Laser Transmission Thickness Detection Module (DTD), Laser Diode 660 nm[2]
CPU—XEON E5-2620 2.0 GHz, 20 MB cache[2]
HDD—3TB[2]
Network Card—Ether Network Card[2]
Monitor—19 inch LCD Monitor[2]
Pointing Device—Optical Trackball[2]
Wafer Sizes—2 inch[2]
Laser Light Source—405 nm Laser Diode; 660 nm Laser Diode[2]
Detection Channel—Scatter (Oblique, Normal); Specular; Topography; Phase; PL (Option)[2]
Transfer Unit—Single Wafer Loading; Automatic Transfer by Wafer Transfer Robot[2]
Operating System—Microsoft Windows Server 2008 Operating system (English Version)[2]
Application Software—Candela 8720 Application Software, Version 10[2]
Custom Specifications—Transformer for stepping up the power supply voltage from 200 V to 230 V[2]
Candela 8720 Application Software—Version 10[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing