Comparison ledger
KLA 0035235-003 MMD Head, KLA 2800, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2800KLA | |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | KLA 2800 |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | SMAC board[2] |
| Model | 0035235-003[1] | — |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| Inspection type | — | Broadband brightfield DUV/UV/VIS[5] |
| Wavelengths | — | Multiple wavelengths (DUV/UV/VIS)[5] |
| Design rule support | — | Sub-65-nm (extends to 45-nm and beyond)[5] |
| Throughput improvement | — | 2X better than previous-generation DUV tool[5] |
| Optical modes | — | Array of optical modes for optimal sensitivity per layer/design/process[5] |
| Defect classification | — | Advanced binning and realtime defect classification[5] |
| Sensitivity and contrast | — | Maximum sensitivity and best material contrast for critical defects across all layers[5] |
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