Comparison ledger
Kawasaki 3 NS 411 B F 003 Atmospheric Wafer Robot, Lapmaster 12 Benchtop Lapping Polishing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 Benchtop Lapping PolishingLapmaster | |
|---|---|---|
| OEM | Kawasaki | Lapmaster |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Kawasaki 3 NS 411 B F 003 Atmospheric Wafer Robot | Lapmaster 12 Benchtop Lapping Polishing |
| Specifications | ||
| Configuration | AMAT 12" CMP[1] | Ring lapper[6] |
| Equipment Type | Atmospheric Wafer Robot[1] | — |
| Wafer Size | 12 inch[1] | — |
| Category | CMP[2] | CMP[4] |
| Manufacturer | Kawasaki[1] | — |
| Model | 3 NS 411 B F 003[1] | 12[3] |
| Make | — | Lapmaster[3] |
| Type/Application | — | Single sided[5] |
| Plate diameter | — | 12 in[5] |
| No. of conditioning rings | — | 3[6] |
| Base | — | Rigid, lightweight, cast aluminum base[6] |
| Standard RPM | — | 60 RPM[6] |
| RPM range with variable speed drive | — | 0-60[6] |
| Drive motor - lapper | — | 0.5 HP[6] |
| Drive motor - polisher | — | 0.75 HP[6] |
| Length | — | 25 in[6] |
| Width | — | 18 in[6] |
| Height | — | 24 in[6] |
| Estimated shipping weight | — | 240 lbs[6] |
| Approximate weight | — | 135 lbs / 61 kg[7] |
| Approximate dimensions | — | 24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[7] |
| Electrical system | — | Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[7] |
| Motor | — | 1/3 hp / 0.25 kW motor with gear reducer[7] |
| Abrasive feed system | — | Designed for water or oil based lapping slurries[7] |
| Automatic cycle timer | — | Automatic digital cycle timer[7] |
| Ring configuration | — | Ring lapper[6] |
| Ring ID | — | 4.25 inches[6] |