Waferpedia

Comparison ledger

1305 BSG 3versusAutomegasamdri 915B

Hitachi 1305 BSG 3, Tousimis Automegasamdri 915B, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1305 BSG 3Hitachi
OEMHitachiTousimis
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHitachi 1305 BSG 3Tousimis Automegasamdri 915B
Specifications
Equipment type—Critical point dryer[1]
Process mode—Samples are dried at the CO2 supercritical point[1]
Starting medium—Ultra pure ethanol[1]
Chamber pressure before opening—0 psi[1]
Operation modes mentioned—Auto Mode, HEAT, BLEED, VENT, COOL[1]
Type—Automated critical point drying system[2]
Substrate size—Up to 150 mm wafer[2]
Manufacturer location—Rockville, MD, United States[3]
Use—Drying freshly released structures with minimum sticking issues[1]
Drying medium—CO2 at the supercritical point[1]

Plan your fab

Building a Wet Processing / Clean process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]epfl.chepfl.ch
  2. [2]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  3. [3]frontiersin.orgfrontiersin.org