Comparison ledger
Hitachi 1305 BSG 3, Kurt Lesker Nano36, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1305 BSG 3Hitachi | Nano36Kurt Lesker |
|---|---|---|
| OEM | Hitachi | Kurt Lesker |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi 1305 BSG 3 | Kurt Lesker Nano36 |
| Specifications | ||
| OEM | — | Kurt J Lesker[1] |
| Model | — | Nano36 Thermal Deposition System[1] |
| Equipment type | — | Cleanroom Instrumentation[1] |
| Process category | — | Thin Film Fabrication[1] |
| Location | — | FNT 4.106[1] |
| Equipment Type | — | Cleanroom Instrumentation; Thin Film Fabrication[2] |
| Deposition type | — | thermal deposition of metals[2] |
| Substrate size | — | up to 150 mm in diameter[2] |
| Automated process control | — | KJL eKLipse software with a graphical recipe builder[2] |
| Deposition sources | — | two thermal sources for co-deposition and four sources for sequential deposition[2] |
| Source characteristics | — | DC power supply rated up to 12 V or 400 A; maximum applied power 2 kW[2] |
| Shutters and shielding | — | substrate and source shutters with cross-contamination shields[2] |
| Substrate rotation | — | up to 20 rpm[2] |
| Thickness monitoring | — | two crystal sensors with controller-based deposition rate and film thickness control[2] |
| System base pressure | — | 5.0 × 10^-6 Torr[2] |
| Film uniformity | — | <8%[2] |
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