Waferpedia

Comparison ledger

LW1089versus10100

Hesse & Knipps LW1089, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
LW1089Hesse & Knipps
10100West Bond
OEMHesse & KnippsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHesse & Knipps LW1089West Bond 10100
Specifications
Product areaLaser Welder[1]—
Model listingLW1089[1]—
Machine typeFully automatic laser welding system with a large working area[2]—
ProcessFully and semi-automatic deep penetration welding[2]—
MaterialsAluminum and copper leads[2]—
ApplicationsDCB substrates, power electronics, battery cells and modules, and other electronics manufacturing components[2]—
Working area (X×Y×Z)410 mm × 480 mm × 75* mm[2]—
Laser beam source max. power1.5 kW[2]—
Laser beam source wavelength1070 nm[2]—
Beam qualitySingle Mode[2]—
Optics max. working area12 mm x 12 mm[2]—
Optics max. power1.3 kW, cw[2]—
Permissible wavelength1070 nm[2]—
Focus spot diameter< 50 µm[3]—
Line welding speedup to 1000 mm/s[2]—
Wobble frequencyup to 1000 Hz[2]—
Down hold forceup to 120 N[2]—
Max. immersion depth100 mm[2]—
P-rotation360°[2]—
Footprint1480 x 2150 x min. 2092 mm[2]—
External switch cabinet800 x 1000 x 2100 mm[2]—
OperationFully and semi-automatic[2]—
Working area410 mm × 480 mm × 75 mm (X × Y × Z)[2]—
Laser beam source power1.5 kW[2]—
Laser beam qualitySingle Mode[2]—
Maximum hold-down forceUp to 120 N[2]—
Maximum immersion depth100 mm[2]—
Optics working area12 mm × 12 mm[2]—
Maximum optical power1.3 kW, cw[2]—
Maximum line welding speedUp to 1000 mm/s[2]—
Maximum wobble frequencyUp to 1000 Hz[2]—

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Sources (3)Every fact above is drawn from these public sources
  1. [1]hesse-mechatronics.comhesse-mechatronics.com
  2. [2]hesse-mechatronics.comhesse-mechatronics.com
  3. [3]diagon.aidiagon.ai