Waferpedia

Comparison ledger

8500 Waferversus1505 G 6 E

GCA 8500 Wafer, Nikon 1505 G 6 E, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMGCANikon
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run—1988–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyGCA 8500 WaferNikon 1505
Specifications
Configuration5 Axis[1]5" reticle[4]
Equipment typeCommercial wafer stepper[2]—
OEMGCA[1]—
Reduction ratio5x[1]—
Exposure sourcei-line[2]—
Resolution capabilitySub-micron features[3]—
Axis configuration5-axis[1]—
Wafer diameter150 mm[2]—
Wafer geometry supported1-flat, 2-flat, notched, no-flat[2]—
Wafer materials supportedSilicon, silicon on insulator[2]—
Wafer thickness range500–700 µm[2]—
Batch size1 wafer (150 mm)[2]—
Demonstrated wafer use6-inch silicon-on-insulator wafer[3]—
Resolution—650 nm[5]
Numerical Aperture—0.54[5]
Reduction—5x[5]
Exposure Field—15 x 15 mm[5]
Alignment Accuracy—130 nm[5]
Wafer Size—4 inch[4]
Light Source—g-line[6]
Introduction Year—1988[5]
NA (Numerical Aperture)—0.54[5]
Make—Nikon[4]
Model—1505 G 6 E[4]
Category—Stepper[4]
Wafer Sizes—4 inch[4]
Exposure type—g-line[5]
NA—0.54[5]
Exposure field—9.3 x 18.8 mm[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]mems-exchange.orgmems-exchange.org
  3. [3]journals.plos.orgjournals.plos.org
  4. [4]inventory listing
  5. [5]web.archive.orgweb.archive.org
  6. [6]ece.utoronto.caece.utoronto.ca