Comparison ledger
EV Group EV 501 Wafer, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EV 501 WaferEV Group | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | EV Group | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Capable of thermo compression, fusion or anodic wafer bonding | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group EV 501 Wafer | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Configuration | Refurbished[1] | — |
| Wafer size | Capable of thermo compression, fusion or anodic wafer bonding[1] | — |
| Thickness | Max wafer stack thickness 6 mm[1] | — |
| Bottom side heater | 550°C max. in 1°C steps[1] | — |
| Temperature uniformity | ± 1,5 %[1] | — |
| Bonding capability | Capable of thermo compression, fusion or anodic wafer bonding[1] | — |
| Bond chamber | Bond chamber for small pieces up to 150 mm wafers (with correct tooling)[1] | — |
| Vacuum pump | Turbo Pump[1] | — |
| Power supply | High voltage power supply for anodic bonding (additional tooling may be required)[1] | — |
| Electronics | Electronics Rack[1] | — |
| Control/software | Computer & Software[1] | — |
| Display | LCD Monitor[1] | — |
| Pump | Roughing Pump[1] | — |
| Manual | Operations Manual[1] | — |
| Condition | Refurbished[1] | — |
| Wafer Size | — | 6 inch[2] |
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