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40 Top-to-Bottom Side Measurementversus0035235-003 MMD Head

EV Group 40 Top-to-Bottom Side Measurement, KLA 0035235-003 MMD Head, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMEV GroupKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 40KLA 0035235-003 MMD Head
Cited variants—
Specifications
Voltage120-230 V[2]—
Configuration50/60 Hz[2]TSTD PCB ASSY, MMD MEAS HEAD[3]
Manual Alignment StageYes[2]—
PC-based Measurement SystemYes[2]—
Frequency50/60 Hz[2]—
Wafer Sizes2, 3, 4, 5, 6, 8 inch (up to 200 mm)[2]—
Vintage2002[2]—
Measurement TypeDestruction-free alignment accuracy[1]—
Model—0035235-003[3]
Make—KLA[3]
Part Description—TSTD PCB ASSY, MMD MEAS HEAD[3]
Compatible System—KLA AIT-XP[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]inventory listing