Comparison ledger
Esec Datacon 2200 evo plus, MRSI 505 Die Attach, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 505 Die AttachMRSI | |
|---|---|---|
| OEM | Esec | MRSI |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 4" | 4" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Esec Datacon 2200 evo plus | MRSI 505 Die Attach |
| Cited variants | — | |
| Specifications | ||
| Bonding method | Epoxy[3] | — |
| Cycle time | 120 ms with Liquid Cooling option[3] | — |
| Bonding accuracy | 20 µm @ 3σ (15 µm option)[3] | — |
| Wafer size | 4" to 12" (on 8" or 12" wafer frames)[3] | — |
| Die size | 0.25 mm (with Small Die Kit) to 20 mm[3] | — |
| Leadframe size | Length: 90 to 300 mm; Width: 23 to 100 mm[3] | — |
| Machine dimensions | 1785 x 1448 x 1400 mm (W x D x H)[3] | — |
| Bond force | 0.5N to 75N programmable[2] | — |
| Bond heads | Up to 4 working heads in one machine[2] | — |
| Theta placement accuracy | ± 0.15° @ 3σ[2] | — |
| X/Y placement accuracy | ± 10 µm @ 3σ[2] | — |
| Die attach throughput | Up to 7,000 UPH/module[2] | — |
| Flip chip throughput with dipping | Up to 2,500 UPH/module[2] | — |
| Flip chip throughput without dipping | Up to 3,200 UPH/module[2] | — |
| Die attach size | 0.17 mm - 50 mm[2] | — |
| Die size flip chip | 0.5 mm - 50 mm[2] | — |
| Die thickness | >50 µm[2] | — |
| Weight | 1,300 kg[2] | — |
| Frame size | FF070, FF105, FF108, FF123[2] | — |
| Heated bond head | Up to 450°C (optional)[2] | — |
| Product type | Die bonder for Multi Module Attach[4] | — |
| Standard bond head rotation | 0° - 360°[4] | — |
| Wafer Size | — | 4", Also used on Substrate 3x5" and Chip on Tape[5] |
| Configuration | — | Comes with Standard Boats / Cassettes[5] |
| Also used on Substrate | — | 3x5" and Chip on Tape[5] |
| Comes with Standard Boats / Cassettes | — | Yes[5] |
| Vintage (listed unit) | — | 2001[6] |
| Description | — | Die Attach/ Multichip Module[6] |
| Version | — | assembly[6] |
| Manufacturer | — | MRSI[7] |
| Model | — | 505[7] |
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