Comparison ledger
Disco DFG 841 Automatic, Disco DFG 841 Grinder Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DFG 841 AutomaticDisco | |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | CMP |
| Wafer size | — | Robot Unit– automated wafer handling between cassettes and chuck tables. |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFG 841 | Disco DFG 841 |
| Specifications | ||
| Phase | 3 Phase[1] | — |
| Configuration | 50/60 Hz[1] | Vacuum Coolant Unit (VCU) – provides cooling and chip removal (separate floor-standing unit).[2] |
| Power | 17kVA[1] | AC 200V, 50/60 Hz, 3-Phase, 17 kVA[2] |
| Wafer Size | 8 inch[1] | — |
| Power Supply | 3 Phase, 50/60 Hz, AC 200V, 17kVA[1] | — |
| Power Requirements | 3-phase, 50/60 Hz, AC 200V, 17kVA[1] | — |
| Spindle Speed (Max) | — | 7,000 rpm[2] |
| Air Requirement | — | 0.5 MPa (5 kgf/cm²), 300 L/min (ANR)[2] |
| Cutting Water | — | 0.2 MPa (2 kgf/cm²), 15 L/min[2] |
| Cooling Water | — | 0.2 MPa (2 kgf/cm²), 11 L/min[2] |
| Grinding Method | — | In-feed grinding with wafer rotation[2] |
| Accuracy | — | Planarity ≤ 1.5 µm across wafer[2] |
| Wafer size | — | Robot Unit– automated wafer handling between cassettes and chuck tables.[2] |
| Spindle options | — | Configurable for coarse + fine grind[2] |
| Make | — | Disco[2] |
| Model | — | DFG 841[2] |
| Tool type | — | Grinder / Lapper / Polisher[2] |
| Planarity accuracy | — | ≤ 1.5 µm across wafer[2] |
| Vacuum coolant unit | — | Provides cooling and chip removal; separate floor-standing unit[2] |
| Chiller unit | — | Stabilizes grinding fluid temperature[2] |
| Filter unit | — | For grinding water/coolant circulation[2] |
| Robot unit | — | Automated wafer handling between cassettes and chuck tables[2] |
| Transformer | — | 20 kVA, Tokyo Sanyo Denki; converts facility power (208–415 V input to 200 V output)[2] |
| Electrical compartment | — | Control and power distribution[2] |
| Chuck tables | — | Two chuck tables, porous vacuum type[2] |
| Cassette handling | — | Automatic cassette loading/unloading with same-cassette return[2] |
| Wafer thickness measurement | — | Contact gauge system[2] |
| Control/software | — | With HDD and Software[2] |
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